FEATUREDTechnology

The socket is the motherboard, Part 2 — Intel archrival (and Nvidia’s BFF) plans to build giant chips that could use kilowatts of power but they won’t be as big as Cerebras trillion transistor behemoth



A few weeks ago, we wrote how Eliyan’s NuLink PHY could do away with silicon interposers and integrate everything into an single, elegant package. How, essentially, the socket could become the motherboard.

At the recent 30th annual North America Technology Symposium, the Taiwan Semiconductor Manufacturing Company (TSMC) revealed plans to construct a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that could lead to system-in-packages (SiPs) over twice the size of the current largest ones.



Source link

Leave a Reply

Your email address will not be published. Required fields are marked *